Better delayering results - The ULTRACOLLIMATOR option allows for improved parallelism, improving the ‘sweet spot’ of the delayered surface
Fast & repeatable alignment - precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis provide for optical alignment that does not wander
Slurry polishing - A recirculating pump may be added, in addition to the standard coolant system. Slurries are held within a drip tray for easy disposal, or re-use
Avoids cross-contamination - The unique slurry / drip tray concept allows convenient removal and cleaning of all items that come into contact with abrasives and polishing media
Industry-leading supplier - ULTRA TEC has supplied sawing, lapping & polishing equipment to the high-tech industries for over 30 years. Our ASAP-1, ARC-lite, MULTIPOL & ULTRAPOL products have set the standard for sample preparation
Topside delayered IC showing no edge-rounding
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s
Key applications of the technology include:
Topside electronic de-processing - enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR
Backside preparation of packages and wafers, particularly for flip-chips - and rapid global thinning of larger surfaces
Cross-sectioning of die and package-level devices
Along with Ultra Tec’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.
Fast and convenient sample movement between polisher & microscope, coupled with the option of the ULTRACOLLIMATOR optical alignment system, provides reference to the die -- a huge improvement over earlier generation polishers.
The system allows recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a 'Power polish' mode is incorporated that rotates the sample during processing.
Base unit with timer, oscillator, speed control (50 to 400rpm), 8” (200mm) Polishing plate Sample Z-direction control with 1µm precision Mechanical alignment indicator 2 circle tilt control (+/- 2 degrees) Sample Rotation control Quick release interface mounting system 2 sample mounting plates and start-up accessory kit Sample Load Control – 0 to 3 kg (in 50 gram increments) Drip Tray / Slurry Containment Tray
Laser Alignment upgrade, includes...
Main unit, incorporating laser module, cross-hair generator, and 6.5 inch lcd monitor, with Video Out (NTSC) Includes optical flat and mounting bracket for ULTRAPOL advance